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Inspection and Cleaning
Maintenance
6Ć8
Resolder joint and clean with ethyl alcohol.
TableĂ6Ć3:ăInternal Inspection Check List (Cont.)
Item Inspect For Repair Action
Capacitors Damaged or leaking cases. Corroded
solder on leads or terminals.
Remove damaged module and replace
with a new module from the factory.
Semiconductors Loosely inserted in sockets. Distorted
pins.
Firmly seat loose semiconductors. ReĆ
move devices that have distorted pins.
Carefully straighten pins (as required to
fit the socket), using longĆnose pliers,
and reinsert firmly. Ensure that straightĆ
ening action does not crack pins, causĆ
ing them to break off.
Wiring and cables Loose plugs or connectors. Burned,
broken, or frayed wiring.
Firmly seat connectors. Repair or reĆ
place modules with defective wires or
cables.
Chassis Dents, deformations, and damaged
hardware.
Straighten, repair, or replace defective
hardware.
Cleaning Procedure Ċ Interior
If, after doing steps 1 and 2, a module is clean upon inspection, skip the
remaining steps.
1. Blow off dust with dry, lowĆpressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lintĆfree cloth dampened in ethyl
alcohol, and rinse with a warm deionized water. (A cottonĆtipped appliĆ
cator is useful for cleaning in narrow spaces and on circuit boards.)
3. If steps 1 and 2 do not remove all the dust or dirt, the AWG2005 may be
spray washed using a solution of ethyl alcohol by doing step 4 through
8.
4. Gain access to the parts to be cleaned by removing easily accessible
shields and panels (see Removal and Installation Procedures in this
section).
5. Spray wash dirty parts with the ethyl alcohol, and wait 60 seconds for
the majority of the alcohol to evaporate.
6. Use hot (120_ Fto140_ F) deionized water to thoroughly rinse them.
7. Dry all parts with lowĆpressure, deionized air.
8. Dry all components and assemblies in an oven or drying compartment
using lowĆtemperature (125_ Fto150_ F) circulating air.
Lubrication
There is no periodic lubrication required for the AWG2005.