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TMS320C6202
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS072B – AUGUST 1998 – REVISED AUGUST 1999
72
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
MECHANICAL DATA
GJL (S-PBGA-N352) PLASTIC BALL GRID ARRAY
25,00 TYP
0,50
AC
W
U
AA
AE
R
N
L
J
G
E
A
C
2622201612 14 1810862
Seating Plane
4
4173516-2/C 07/99
24
1 3 5 7 9 11131517192123
25
SQ
26,80
27,20
Y
V
P
H
K
M
F
D
B
T
SQ
24,80
25,20
16,30 NOM
See Note E
0,60
0,40
0,70
0,50
Heat Slug
1,00 NOM
AB
AD
AF
3,50 MAX
0,50
16,30 NOM
1,00
0,15
1,00
M
∅ 0,10
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Thermally enhanced plastic package with heat slug (HSL).
D. Flip chip application only
E. Possible protrusion in this area, but within 3,50 max package height specification
F. Falls within JEDEC MO-151/AAL-1
thermal resistance characteristics (S-PBGA package)
NO °C/W Air Flow LFPM
†
1 RΘ
JC
Junction-to-case 0.47 N/A
2 RΘ
JA
Junction-to-free air 14.2 0
3 RΘ
JA
Junction-to-free air 12.3 100
4 RΘ
JA
Junction-to-free air 10.2 250
5 RΘ
JA
Junction-to-free air 8.6 500
†
LFPM = Linear Feet Per Minute
ADVANCE INFORMATION