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7.2.2PowerPAD™PCBFootprint
Thermal Pad on Top Copper
should be as large as Possible.
Soldermask opening should be smaller and match
the size of the thermal pad on the DSP.
7.3PackagingInformation
TMS320C6727,TMS320C6726,TMS320C6722
Floating-PointDigitalSignalProcessors
SPRS268E–MAY2005–REVISEDJANUARY2007
TexasInstruments'PowerPADThermallyEnhancedPackageTechnicalBrief(literaturenumber
SLMA002)shouldbeconsultedwhencreatingaPCBfootprintforthisdevice.Ingeneral,forproper
thermalperformance,thethermalpadunderthepackagebodyshouldbeaslargeaspossible.However,
thesoldermaskopeningforthePowerPAD™shouldbesizedtomatchthepadsizeonthe144-pinRFP
package;asillustratedinFigure7-2.
Figure7-2.SoldermaskOpeningShouldMatchSizeofDSPThermalPad
Thefollowingpackaginginformationreflectsthemostcurrentreleaseddataavailableforthedesignated
device(s).Thisdataissubjecttochangewithoutnoticeandwithoutrevisionofthisdocument.
Onthe144-pinRFPpackage,theactualsizeoftheThermalPadis5.4mm×5.4mm.
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