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7.2SupplementaryInformationAboutthe144-PinRFPPowerPAD™Package
7.2.1StandoffHeight
Standoff Height
TMS320C6727,TMS320C6726,TMS320C6722
Floating-PointDigitalSignalProcessors
SPRS268E–MAY2005–REVISEDJANUARY2007
Thissectionhighlightsafewimportantdetailsaboutthe144-pinRFPPowerPAD™package.Texas
Instruments'PowerPADThermallyEnhancedPackageTechnicalBrief(literaturenumberSLMA002)
shouldbeconsultedbeforedesigningaPCBforthisdevice.
AsillustratedinFigure7-1,thestandoffheightspecificationforthisdevice(between0.050mmand
0.150mm)ismeasuredfromtheseatingplaneestablishedbythethreelowestpackagepinstothelowest
pointonthepackagebody.Duetowarpage,thelowestpointonthepackagebodyislocatedinthecenter
ofthepackageattheexposedthermalpad.
Usingthisdefinitionofstandoffheightprovidesthecorrectresultfordeterminingthecorrectsolderpaste
thickness.AccordingtoTI'sPowerPADThermallyEnhancedPackageTechnicalBrief(literaturenumber
SLMA002),therecommendedrangeofsolderpastethicknessforthispackageisbetween0.152mmand
0.178mm.
Figure7-1.StandoffHeightMeasurementon144-PinRFPPackage
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