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7MechanicalData
7.1PackageThermalResistanceCharacteristics
TMS320C6727,TMS320C6726,TMS320C6722
Floating-PointDigitalSignalProcessors
SPRS268E–MAY2005–REVISEDJANUARY2007
Table7-1andTable7-2providethethermalcharacteristicsfortherecommendedpackagetypesusedon
theTMS320C672xDSP.
Table7-1.ThermalCharacteristicsforGDH/ZDHPackage
AIRFLOW
NO.°C/W
(m/s)
Two-Signal,Two-Plane,101.5x114.5x1.6mm,2-ozCu.EIA/JESD51-9PCB
1Rθ
JA
ThermalResistanceJunctiontoAmbient250
2Rθ
JB
ThermalResistanceJunctiontoBoard14.50
3Rθ
JC
ThermalResistanceJunctiontoTopofCase100
4Ψ
JB
ThermalMetricJunctiontoBoard140
5Ψ
JT
ThermalMetricJunctiontoTopofCase0.390
Table7-2.ThermalCharacteristicsforRFPPackage
THERMALPADCONFIGURATION
AIR
NO.°C/WFLOW
VIA
TOPBOTTOM
(m/s)
ARRAY
Two-Signal,Two-Plane,76.2x76.2mmPCB
(1)(2)(3)
1Rθ
JA
ThermalResistanceJunctiontoAmbient10.6x10.6mm10.6x10.6mm6x6200
7.5x7.5mm7.5x7.5mm5x5220
2Ψ
JP
ThermalMetricJunctiontoPowerPad10.6x10.6mm10.6x10.6mm6x60.390
Double-Sided76.2x76.2mmPCB
(1)(2)(4)
3Rθ
JA
ThermalResistanceJunctiontoAmbient10.6x10.6mm10.6x10.6mm6x6490
10.6x10.6mm38.1x38.1mm6x6270
10.6x10.6mm57.2x57mm6x6220
10.6x10.6mm76.2x76.2mm6x6200
4Ψ
JP
ThermalMetricJunctiontoPowerPad10.6x10.6mm10.6x10.6mm6x60.390
(1)PCBmodeledwith2oz/ft
2
TopandBottomCu.
(2)PackagethermalpadmustbeproperlysolderedtotoplayerPCBthermalpadforboththermalandelectricalperformance.Thermalpad
isV
SS
.
(3)ToplayerthermalpadisconnectedthroughviaarraytobothbottomlayerthermalpadandinternalV
SS
plane.
(4)Toplayerthermalpadisconnectedthroughviaarraytobottomlayerthermalpad.
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