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MZ-B10
3838
6-4. Printed Wiring Board – MAIN Board (Side B) – :Uses unleaded solder.
IC801
IC802
IC501
IC601
IC701
IC901
IC301
IC302
MAIN BOARD
(SIDE B)
*
CSP(Chip Size Package)
OVER WRITE HEAD
SWITCH
&
LCD MODULE
DC IN 3V
J601
M602
(SLED)
M601
(SPINDLE)
M603
OVER WRITE
HEAD UP/DOWN
1
M
10
DRY BATTERY
SIZE"AA"
(IEC DESIGNATION LR6)
2Pcs. 1.5V
J303
RVDD
DTCK
KEY-R
RGND
HP-DET
REMOTE
J301
MIC
(PLUG IN POWER)
+
-
MIC901
FLAT MIC
TP1322
TP1323
(
)
1-687-753-
11
(11)
S804
(PROTECT)
S805
HOLD
ON OFF
SP902
(B)
S901
(A)
-
-
+
+
BLK
RED
WHT
BLU
(GND)
*
CSP(Chip Size Package)
20 1
(VREC)
(REGO1)
(VCO1)
(REGO3)
(VCOUT)
48
49
1
64
33
32
17
16
R905
R925
1
10
2
1
N
N
W
W
U
U
V
V
SL802
(OPEN/CLOSE)
12
A
B
C
D
E
F
G
H
I
345678910111213
• Semiconductor
Location
Ref. No. Location
D301 D-12
D304 E-12
D305 G-12
D306 F-12
D307 C-12
D308 C-12
D309 G-12
D310 F-12
D603 B-3
D605 C-6
D608 B-2
D609 B-3
D802 B-11
D851 B-11
D852 B-11
D901 D-11
D902 C-10
D903 D-10
IC301 F-10
IC302 H-11
IC501 E-6
IC601 B-6
IC701 E-8
IC801 G-6
IC802 E-5
IC901 D-10
Q304 E-11
Q306 H-11
Q307 H-10
Q308 I-10
Q313 D-11
Q314 E-12
Q315 E-12
Q602 B-4
Q603 B-7
Q801 C-8
Q851 C-10
Q853 B-10
Q854 B-11
Q901 B-12
Q902 C-11