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PREFIX
TMS 320 F 28015 PZ
TMX = Experimental Device
TMP = Prototype Device
TMS = Qualified Device
DEVICE FAMILY
320 = TMS320E DSP Family
TECHNOLOGY
PACKAGE TYPE
PZ = 100-Pin Low-Profile Quad Flatpack (LQFP)
GGM = 100-Ball Ball Grid Array (BGA)
ZGM = 100-Ball Lead-Free BGA
F = Flash EEPROM
(1.8-V Core/3.3-V I/O)
C = ROM
(1.8-V Core/3.3-V I/O)
DEVICE
2809
2808
2806
2802
2801
28015
28016
TEMPERATURE RANGE
A = –405C to 855C
S = –405C to 1255C
Q = –405C to 1255C — Q100 Qualification
A −60
Indicates 60-MHz device
Absence of “−60” indicates
100-MHz device.
TMS320F2809, TMS320F2808, TMS320F2806
TMS320F2802, TMS320F2801, TMS320C2802
TMS320C2801, TMS320F28016, TMS320F28015
www.ti.com
SPRS230L–OCTOBER 2003–REVISED DECEMBER 2009
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GGM) and temperature range (for example, A). Figure 5-1 provides a legend
for reading the complete device name for any family member.
Figure 5-1. Example of TMS320x280x/2801x Device Nomenclature
Copyright © 2003–2009, Texas Instruments Incorporated Device Support 87
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Product Folder Link(s): TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802
TMS320C2801 TMS320F28016 TMS320F28015