Filter
Top Products
3
MZ-B100
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(LCX-4R)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering
bridge to the laser-tap on the flexible board. Also perform measures
against electrostatic break-down sufficiently before the operation.
The flexible board is easily damaged and should be handled with
care.
OPTICAL PICK-UP FLEXIBLE BOARD
SECTION 1
SERVICING NOTES
• When repairing this device with the power on, if you remove the
MAIN board or open the upper panel assy, this device stops work-
ing.
In this case, you can work without the device stopping by fasten-
ing the hook of the open/close detect switch (S804).
• This set is designed to perform automatic adjustment for each
adjustment and write its value to EEPROM. Therefore, when
EEPROM (IC802) has been replaced in service, be sure to per-
form automatic adjustment and write resultant values to the new
EEPROM.
(Refer to Section 5 Electrical Adjustment. (page 19))
• Replacement of CXD 2671-209GA (IC801) used in this set re-
quires a special tool.
laser-ta
p
S804
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.