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TPA005D12 Class-D EVM Bill of Materials
3-25
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3.8 TPA005D12 Class-D EVM Bill of Materials
The components in the bill of materials (Table 3–5) were selected for their
common values, availability, and the smallest size available to meet these
criteria.
Table 3–5.TPA005D12 Class-D EVM Bill of Materials
Reference Description Size
EVM
Qty.
Manufacturer/
Part Number
C17 Capacitor, Ceramic Chip, 0.1 µF, ±10%,
50 V, X7R
0805 1 Kemet
C0805C104K5RAC
C1, C2, C3, C4,
C8, C10, C11,
C15, C16, C24,
C25
Capacitor, Ceramic Chip, 1 µF, ±10%,
16 V, X7R
1206 10 TDK
C3216X7R1C105K
C18, C19 Capacitor, Ceramic Chip, 47 nF, ±10%,
50 V, X7R
0805 2 Kemet
C0805V473K5RAC
C5, C6, C7 Capacitor, Ceramic Chip, 470 pF, ±5%,
50 V, C0G,
0805 3 Kemet
C0805C471J5GAC
C9, C12 Capacitor, Ceramic Chip, 10 µF, +80%–20%,
25 V, Y5V
1210 2 muRata
GRM235Y5V106Z25
C13, C14 These pads are provided for increase of bulk
capacitance as required to meet voltage ripple
and temperature operating range specifications.
0.0236” ×
0.138”
C20, C21, C22,
C23
Capacitor, Ceramic Chip, 0.22 µF, ±10%,
16 V, X7R
1206 4 Kemet
C1206C224K4RAC
L1, L2, L3, L4 Inductor, SMT, 15 µH, ±20%, 2.2 ADC, 47.2 mΩ
@ 1 kHz, –20 to +90°C
0.398” × 0.398”
× 0.220”
4 TDK
SLF10145–150
L1, L2, L3, L4
Alternate Value
Inductor, SMT, 15 µH, ±20%, 1.1 ADC, 75 mΩ
@ 1 kHz, –20 to +85°C
0.276” × 0.276”
× 0.126”
4 TDK
SLF7032–150
R1, R2 Resistor, Thick Film Chip, SMD, 100 kΩ, ±5%,
1/16 W, 150 V, –50 to 150°C, ±200 ppm/°C
0603 2 Vishay/Dale
CRCW0603104J
Headers, 0.100 in. centers, 1/2 in length 0.5”, 0.25”,
0.1”
14 Samtec
TSW–19–8–G–S
TP1, TP2, TP3,
TP5– TP11
Test Point, Red 10 Farnell
240–345
TP4, TP12 Test Point, Black 2 Farnell
240–333
S1, S2 Switch, Momentary, Push Button, 12 VDC,
50 mA
0.291” × 0.138”
× 0.134”
2 Panasonic
EVQ-PJS04K
U1 IC, Audio amplifier, class-D,
2 W, 48 pin, DCA pkg
TSSOP48 1 TI
TPA005D12DCA