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© Philips Electronics N.V. 2001. Printed in the U.S.A
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 07 October 1998 Document order number: 9397 750 07427
Contents
Philips Semiconductors
SA5211
Transimpedance amplifier (180 MHz)
1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
4.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 3
8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 3
9 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Typical performance characteristics . . . . . . . 10
11 Theory of operation . . . . . . . . . . . . . . . . . . . . 13
12 Bandwidth calculations . . . . . . . . . . . . . . . . . 14
13 Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14 Dynamic range calculations . . . . . . . . . . . . . 15
15 Application information. . . . . . . . . . . . . . . . . . 18
15.1 Die sales disclaimer . . . . . . . . . . . . . . . . . . . . 20
16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22
17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
17.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
17.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 23
17.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23
17.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24
17.5 Package related soldering information . . . . . . 24
18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25
19 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26
20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
21 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26