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Philips Semiconductors
SA5211
Transimpedance amplifier (180 MHz)
Product specification Rev. 03 — 07 October 1998 21 of 28
9397 750 07427
© Philips Electronics N.V. 2001. All rights reserved.
processes are utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this process. There
is no post waffle pack testing performed on individual die.
Since Philips Semiconductors has no control of third party procedures in the handling
or packaging of die, Philips Semiconductors assumes no liability for device
functionality or performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85% after assembling
die into their respective packages, with care customers should achieve a similar yield.
However, for the reasons stated above, Philips Semiconductors cannot guarantee
this or any other yield on any die sales.