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9397 750 13928 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 03 – 23 August 2004 29 of 31
Philips Semiconductors
PNX2000
Audio video input processor
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Hot bar or manual soldering is suitable for PMFP packages.
14. Revision history
Table 28: Revision history
Rev Date CPCN Description
03 20040823 Minor revision (9397 750 13928)
02 20040712 Upgraded to Product data (9397 750 13591). Table 3
and Ta bl e 4 added.
01 20040504 Preliminary data (9397 750 12066)