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2000 Oct 16 8
Philips Semiconductors Product specification
GSM/DCS/PCS power amplifier CGY2014TT
APPLICATION INFORMATION
handbook, full pagewidth
FCA174
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
CGY2014TT
TRL2
TRL1
n.c.
TRL3
10 nF
3.9 nH
3.3 nH
100 pF
1
pF
V
d23DCS
V
d1DCS
V
d1GSM
RF
in
GSM
RFI
LB
RF
in
DCS
100 pF
1 nF
4.7
pF
6 pF
4 pF
TRL6
TRL4 TRL5
BA891
56 pF
4.7 pF 9.1 pF
100 pF
3 pF
2.7 pF
5.6 pF
3.3 kΩ
1 nF
n.c. n.c.
n.c.
n.c.
n.c.
n.c.
(1)
GND
RFI
HB
V
DD1HB
V
DD2HB
V
DD2HB
V
DD2LB
V
DD1LB
RFO/V
DD3HB
RF
out
DCS
RF
out
GSM
Vpin
RFO/V
DD3HB
RFO/V
DD3LB
RFO/V
DD3LB
GND1
LB
V
d23GSM
Fig.7 Application diagram.
(1) Pin 16 is internally connected to ground and should not be connected to the board.
(2) Transmission lines:
Thickness 0.4 mm, substrate FR4 and ε
r
= 4.7.
TRL1: width = 500 µm, length = 4.5 mm.
TRL2: width = 500 µm, length = 20 mm.
TRL3: width = 150 µm, length = 30 mm.
TRL4: width = 500 µm, length = 4 mm.
TRL5: width = 500 µm, length = 1.5 mm.
TRL6: width = 500 µm, length = 13 mm.