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2000 Oct 16 10
Philips Semiconductors Product specification
GSM/DCS/PCS power amplifier CGY2014TT
PACKAGE OUTLINE
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2)
Z
(1)
D
h
eLL
p
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.20
0.09
6.6
6.4
4.3
4.1
E
h
H
E
3.1
2.9
4.5
4.3
0.65
6.6
6.2
0.5
0.2
8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT527-1
99-11-12
00-07-12
w M
b
p
D
D
h
E
h
Z
heathsink side
e
0.25
110
20
11
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm
SOT527-1
A
max.
1.10
pin 1 index