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Description
1-3
Introduction
1.2 Description
The TPA701 MSOP Audio Power Amplifier Evaluation Module is a complete,
low-power single-channel audio power amplifier. It consists of the TI TPA701
700-mW Low-Voltage Audio Power Amplifier IC in a very small MSOP
package, along with a small number of other parts mounted on a circuit board
that is approximately one and a quarter inches square (Figure 1–1).
Figure 1–1. The TI TPA701 Audio Amplifier Evaluation Module
OUT+
IN
GND
Vdd GND
U1
†
R2
Shutdown
R3
OUT–
GND
C3
TEXAS
INSTRUMENTS
SLOP213
TPA701 MSOP EVM
C5
C2
C1
C4
S1
R1
+
†
Due to the very small size of the MSOP IC package, the standard part number TPA701 is replaced with the code TIABA.
Single in-line header pins are mounted to the underside of the module circuit
board to allow the EVM to be plugged into the TI Plug-N-Play Audio Amplifier
Evaluation Platform or to be wired directly into existing circuits and equipment
when used stand-alone.
The platform has room for a pair of TPA701 MSOP evaluation modules and
is a convenient vehicle for demonstrating TI’s audio power amplifier and
related evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
and connects them to a versatile array of standard audio input and output jacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.