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MDS-S50
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
• 5 : fusible resistor.
• C : panel designation.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : STOP
( ) : PLAY
< > : REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E : PLAY (ANALOG OUT)
j : REC (ANALOG IN)
l : REC (DIGITAL IN)
• Abbreviation
AR : Argentina model
AUS : Australian model
BR : Brazilian model
CND : Canadian model
HK : Hong Kong model
SP : Singapore model
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
• Indication of transistor
C
B
These are omitted.
E
Q
B
These are omitted.
CE
Q
B
These are omitted.
CE
Q