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◆ DSM (Discrete Surface Mount) Technology
The
DSM
(Discrete Surface Mount) manufacturing process com-
bines the advantages of both discrete components and integrated
circuitry. Rockford Fosgate is the only American amplifier manu-
facturer to have invested millions into this process. DSM compo-
nents differ from conventional discrete components in three
ways. They are more compact, more rugged, and they efficiently
dissipate generated heat. Using them wherever appropriate al-
lows the advantages associated with discrete circuitry to be
retained while also providing room for both highly advanced
processing features and generous PC board copper paths where
needed. Their short lead-out structures allow maximum audio
performance and highest signal-to-noise ratios to be obtained in
amplifiers of desirable package size without resorting to “ampli-
fier-on-a-chip” shortcuts. These advantages are shown in Figure 1.
Surface Mount
Thru-Hole
Solder
Solder
Component
Figure 1
THE RESULT: Fewer connections, improved reliability, shorter
signal paths, superior signal-to-noise ratio and awesome sonic
performance.
◆ XCard (Internal Crossover)
The Punch and Power amplifiers utilize internal active cross-
overs. These crossovers have many performance advantages such
as using discrete components for exact frequency adjustments
which are far superior to potentiometers. Additionally, the XCard
can be configured for high-pass, low-pass and full range opera-
tion. With slight modifications, many crossover frequencies and
slope configurations can be achieved.
THE RESULT: Increased system design flexibility with a precise
electronic crossover without the limitations of conventional
potentiometer designs.
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