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TZA3046_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 19 May 2006 14 of 15
Philips Semiconductors
TZA3046
Fiber Channel/Gigabit Ethernet transimpedance amplifier
17. Legal information
17.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status ofdevice(s) described in thisdocumentmay have changed sincethisdocumentwaspublished and may differ in caseof multiple devices. The latestproductstatus
information is available on the Internet at URL
http://www.semiconductors.philips.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
informationincluded hereinand shallhaveno liabilityforthe consequencesof
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
withthe sameproduct typenumber(s)andtitle. Ashort datasheet isintended
forquick reference onlyand should notbe relied uponto contain detailedand
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In caseof anyinconsistency or conflict withthe short data sheet,
the full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice.This document supersedesand replaces allinformation supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction ofa PhilipsSemiconductors productcan reasonablybe expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the AbsoluteMaximum RatingsSystem ofIEC 60134) maycause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors.In case ofany inconsistencyor conflict betweeninformation
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance orimplication of anylicense under anycopyrights, patents
or other industrial or intellectual property rights.
Bare die — All die are tested on compliance with all related technical
specifications asstated inthis data sheetup to thepoint ofwafersawing for a
period of ninety (90) days from the date of delivery by Philips
Semiconductors. If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
Philips Semiconductors has no control of third party procedures in the
sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device functionality or performance
of the die or systems after third party sawing, handling, packing or assembly
of the die. It is the responsibility of the customer to test and qualify their
application in which the die is used.
All diesales are conditionedupon andsubject to thecustomer entering intoa
written die sale agreement with Philips Semiconductors through its legal
department.
17.4 Trademarks
Notice:All referencedbrands,productnames, servicenames andtrademarks
are the property of their respective owners.
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.