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Philips Semiconductors
TDA8943SF
6 W mono Bridge Tied Load (BTL) audio amplifier
Product specification Rev. 02 — 7 April 2000 13 of 20
9397 750 06865
© Philips Electronics N.V. 2000. All rights reserved.
14.1.2 Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR – typical 100 nF – has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor – e.g. 1000 µF or greater – must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
Fig 14. Printed-circuit board layout (single-sided); components view.
i
dth
MGU037
ON
MUTE
220 nF
220 nF
100 nF
1.5 nF
1000 µF
10 µF
1
9
+−
IN−
IN+
OUT+
OUT−
V
CC
GND
54 mm
56 mm