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◆ DSM (Discrete Surface Mount) Technology
The
DSM
(Discrete Surface Mount) manufacturing process combines the
advantages of both discrete components and integrated circuitry. Rockford
Fosgate is the only American amplifier manufacturer to have invested millions
into this process. DSM components differ from conventional discrete compo-
nents in different ways. They are more compact, more rugged, and they
efficiently dissipate generated heat. Using them wherever appropriate allows
the advantages associated with discrete circuitry to be retained while also
providing room for both highly advanced processing features and generous
PC board copper paths where needed. Their short lead-out structures allow
maximum audio performance and highest signal-to-noise ratios to be
obtained in amplifiers of desirable package size without resorting to “ampli-
fier-on-a-chip” shortcuts. These advantages are shown below in Figure 1.
THE RESULT: Fewer connections, improved reliability, shorter signal paths,
superior signal-to-noise ratio and awesome sonic performance.
Figure 1
◆ XCard (Internal Crossover)
The Punch amplifiers utilize internal active crossovers. These crossovers have
many performance advantages such as using discrete components for exact
frequency adjustments which are far superior to potentiometers. Additionally,
the
XCard
can be configured for high-pass, low-pass and full range
operation. With slight modifications, many crossover frequencies and slope
configurations can be achieved.
THE RESULT: Increased system design flexibility with a precise electronic
crossover without the limitations of conventional potentiometer designs.
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Solder
Solder
Component
Thru-Hole Surface Mount
PC
Board
PC
Board