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ECHNICAL
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ESIGN
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EATURES
– 2 –
◆ TRANS•ANA
(TRANSconductance Active Nodal Amplifier)
The
TRANS•ANA
(TRANSconductance Active Nodal Amplifier) is a circuit
that allows the audio signal to pass through the amplifier at low voltage. The
signal is directly level-shifted to the fixed high voltage rails via a pair of driver
transistors. Signal linearity is assured by an active node formed by the drive
transistors at ultrasonic frequencies. This allows amplifier performance
similar to trans•
nova
which is highly stable and linear while utilizing the
advantages of a non-floating power supply.
THE RESULT: An extended frequency bandwidth accurately supplied to the
output stages of the amplifier.
◆ TOPAZ (Tracking Operation Pre-Amplifier Zone)
The
TOPAZ
(Tracking Operation Pre-Amplifier Zone) circuitry solves ground
loop noise problems common to automotive amplifier design. This innovative
new development allows vastly improved isolation of the input signal grounds
from the power supply ground of the amplifier. This is accomplished by
allowing the source unit to control the potential “environment” of the entire
input structure or “zone” of the amplifier. This process improves the noise
rejection of the amplifier by 30-40dB – an astounding 30-100 times better
than amplifiers without TOPAZ.
THE RESULT: Elimination of troublesome ground loop noise between source
and amplifier.
◆ MEHSA (Maximum Efficiency Heat Sink Application)
The
MEHSA
(Maximum Efficiency Heat-Sink Application) is a proprietary
process that yields up to 5 times better heat transfer than traditional FET
mounting techniques using the exact same components. A multi-layer
insulated metal substrate operating with minimal thermal resistance spreads
heat both downward & outward to quickly dissipate heat from each device
across the heat sink. This process combined with our DSM technology and
MOSFET devices allow us to squeeze more watts per cubic inch from every
output device as well as provide consistent thermal stability.
THE RESULT: Optimized power output, enhanced thermal stability, and
maximum component reliability.