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2000 Nov 15 9
Philips Semiconductors Preliminary specification
UHF amplifier module BGY280
PACKAGE OUTLINE SOT559A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
00-01-31
00-09-28
IEC JEDEC EIAJ
SOT559A
0 5 10 mm
scale
Leadless surface mounted package; plastic cap; 16 terminations
SOT559A
A
c
E
1
D
123
11
12
13
14
15
16
10 9
4
5
6
7
8
D
1
E
e
1
L (12×) b (12×)
L
1
(4×)
e
2
e
2
e
e
e
1
pin 1 index
UNIT
mm
1.1
0.9
3.5
3.3
1.9
1.5
2.6 4.4
bb
1
2.9
2.7
b
2
DIMENSIONS (mm are the original dimensions)
A
5.275
5.075
b
3
4.2
4.0
b
4
1.2
1.0
b
5
0.625
0.425
b
6
0.8
0.6
b
7
0.9
0.7
b
8
14.05
13.45
D
0.55
0.45
c
13.6
13.3
D
1
11.3
10.7
Ee
3.3
e
1
10.85
10.55
1.1
0.9
E
1
e
2
L
2.6
2.4
Z
1.6
1.4
L
1
2.5
2.3
Z
1
0.6
0.4
L
2
1.6
1.4
L
3
3.5
3.3
Z
2
2.9
2.7
Z
3
1.1
0.9
Z
4
1.5
1.3
Z
5
1.1
0.9
Z
6
3.8
3.6
Z
7
1.5
1.3
Z
8
Z (2×)
Z
1
(2×)
L
3
(4×)
Z
5
(4×)
b
6
(4×)
b
1
(2×)b
5
(4×)b
3
(4×)
b
8
(4×)
b
7
(4×)
b
4
(4×)
b
2
(2×)
Z
4
(12×)
Z
6
(12×)
Z
2
(2×)
Dimensions solderresist
L
2
(4×)
Z
8
(6×)
Z
7
(6×)
Z
3
(2×)