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2000 Nov 15 7
Philips Semiconductors Preliminary specification
UHF amplifier module BGY280
Z
1
Z
4
Z
3
Z
2
V
C
V
C
V
S
V
S
RF input RF output
RF outputRF input
GSM1800
BGY280
GSM900
12
13
15
16
8
7
5
4
Fig.11 Test circuit
List of components (See Fig 10 and 11)
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (ε
r
=2.2);
thickness
1
⁄
32
inch.
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
C
1
, C
4
multilayer ceramic chip capacitor 100 µF; 40 V
C
2
, C
3
electrolytic capacitor 100 nF
Z
1
, Z
2
, Z
3
, Z
4
stripline; note 1 50 Ω width 2.33 mm
R1, R
2
metal film resistor 100 Ω; 0.6 W 2322 156 11001