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1. SERVICING NOTE···················································· 3
2. GENERAL ·································································· 4
3. DISASSEMBLY
3-1. “Panel Block Assy, Upper”,
“Holder Assy” ································································· 5
3-2. Mechanism Deck ···························································· 5
3-3. Bracket Assy ··································································· 6
3-4. Main Board ····································································· 6
3-5. Optical Pick-up Block ···················································· 7
4. TEST MODE ······························································ 8
5. ELECTRICAL ADJUSTMENTS ··························· 12
6. DIAGRAMS
6-1. Block Diagram ······························································ 17
6-2. Printed Wiring Boards – Main Section (1/2) – ············· 19
6-3. Printed Wiring Boards – Main Section (2/2) – ············· 21
6-4. Schematic Diagram – Main Section (1/3) –·················· 23
6-5. Schematic Diagram – Main Section (2/3) –·················· 25
6-6. Schematic Diagram – Main Section (3/3) –·················· 27
6-7. IC Block Diagrams ······················································· 29
6-8. IC Pin Function Description ········································· 31
7. EXPLODED VIEWS
7-1. Main Section ································································· 37
7-2. Mechanism Deck Section (MT-MZE500-174) ············· 38
8. ELECTRICAL PARTS LIST ·································· 39
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.