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MDR-IF4000
TABLE OF CONTENTS
Specifications ............................................................................ 1
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. Front Plate (R) Assy ........................................................ 4
2-3. RX Board .........................................................................5
2-4. Hunger (R)....................................................................... 5
2-5. Wiring On The Right Side............................................... 6
2-6. Front Plate (L) Assy ........................................................ 6
2-7. Batt Board........................................................................ 7
2-8. Hanger (L) ....................................................................... 7
2-9. Wiring On The Left Side ................................................. 8
2-10. Hunger Lid (L) ................................................................ 8
2-11. Wiring On The SW Board ............................................... 9
2-12. How To Hang The Tension Spring .................................. 9
3. DIAGRAMS
3-1. Circuit Boards Location .................................................. 10
3-2. Block Diagrams ............................................................... 11
3-3. Printed Wiring Board – Receiver Section – ....................12
3-4. Printed Wiring Board – Power Section – ........................13
3-5. Schematic Diagram – Receiver Section – ....................... 14
4. EXPLODED VIEWS
4-1. Housing (L) Assy Section................................................ 17
4-2. Housing (R) Assy Section ...............................................18
5. ELECTRICAL PARTS LIST ..................................19
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• Repaier DP-IF4000 with MDR-IF4000.