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NXP Semiconductors
SA58670A
2.1 W/channel stereo class-D audio amplifier
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 October 2008
Document identifier: SA58670A_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
19. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
10 Typical performance curves . . . . . . . . . . . . . . . 7
11 Application information. . . . . . . . . . . . . . . . . . 16
11.1 Power supply decoupling considerations . . . . 16
11.2 Input capacitor selection. . . . . . . . . . . . . . . . . 16
11.3 PCB layout considerations . . . . . . . . . . . . . . . 17
11.4 Filter-free operation and ferrite bead filters. . . 17
11.5 Efficiency and thermal considerations . . . . . . 18
11.6 Additional thermal information . . . . . . . . . . . . 18
12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 18
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
14 Soldering of SMD packages . . . . . . . . . . . . . . 20
14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 20
14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 20
14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20
14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 21
15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22
16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22
17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
18 Contact information. . . . . . . . . . . . . . . . . . . . . 23
19 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24