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MZ-E501
2-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) –
12
A
B
C
D
E
F
G
H
I
34567891011121314
1-681-868-
12
(12)
IC 501
IC 601
IC 301
IC 901
156
7
10
12
131518
1924
C301
S806
GROUP
S804
VOL-
S808
HOLD
OFF
ON
S805
VOL+
S801
S803
S802
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
1PC, 1.5V
(INFO)
E
CSP (Chip Size Package)
MAIN BOARD (SIDE A)
*
E
Ref. No. Location
D101 C-13
D201 C-13
D801 G-10
D855 E-13
D902 H-13
D903 G-14
IC301 B-12
IC501 H-5
IC601 C-6
IC901 G-12
Q301 B-11
Q501 H-3
Q901 G-11
Q902 F-11
Q903 F-11
• Semiconductor
Location
Note on Printed Wiring Boards
• X : parts extracted from the component side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.
• Lead Layouts
Lead layout of
conventional IC
surface
CSP (chip size package)
* Replacement of IC601 used in this set requires a special tool.