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2001 Nov 14 4
Philips Semiconductors Product specification
860 MHz, 20 dB gain push-pull amplifier BGY885B
PACKAGE OUTLINE
UNIT
A
2
max.
c
ee
1
q
Q
max.
q
1
q
2
U
1
max.
U
2
W
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1
0.51
0.38
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4 38.1 25.4 10.2 4.2 44.75 8 0.25 0.1 3.8
bF
p
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115J
0 5 10 mm
scale
A
max.
D
max.
L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J
D
U
1
q
q
2
q
1
b
F
S
A
Z p
E
A
2
L
c
d
Q
U
2
M
w
78923
W
e
e
1
5
p
1
d
max.
y M
B
y M
B
B
99-02-06
y M
B