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2001 Nov 02 5
Philips Semiconductors Product specification
860 MHz, 17 dB gain power doubler amplifier BGD885
PACKAGE OUTLINE
UNIT
A
2
max.
c
ee
1
q
Q
max.
q
1
U
1
max.
U
2
W
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1
0.51
0.38
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4 38.1 25.4
q
2
10.2 4.2 44.75 8 0.25 0.1 3.8
bF
∅ P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115D
0 5 10 mm
scale
A
max.
D
max.
L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads
SOT115D
D
U
1
q
q
1
b
F
S
A
Z
E
A
2
L
c
d
Q
U
2
M
w
78923
W
e
e
1
564
P
yM
B
yM
B
1
B
d
max.
97-04-10
q
2
y M
B