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2001 Nov 15 5
Philips Semiconductors Productspecification
550 MHz, 18.5 dB gain power doubler amplifier BGD502
PACKAGE OUTLINE
UNIT
A
2
max.
c
ee
1
q
Q
max.
q
1
q
2
U
1
max.
U
2
W
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1
0.51
0.38
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4 38.1 25.4 10.2 4.2 44.75 8 0.25 0.1 3.8
bF
p
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115J
0 5 10 mm
scale
A
max.
D
max.
L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J
D
U
1
q
q
2
q
1
b
F
S
A
Z p
E
A
2
L
c
d
Q
U
2
M
w
78923
W
e
e
1
5
p
1
d
max.
y M
B
y M
B
B
99-02-06
y M
B