The enclosure link-down port connects to the enclosure link-up port on the enclosure below it. The
enclosure link-up port connects to the enclosure link-down port on the enclosure above it. Linking the
enclosures enables the rack technician to access all the enclosures through the open link-up/service
port. If more c-Class enclosures are added to the rack, they can be linked through the open enclosure
link-up port on the top enclosure or the link-down port on the bottom enclosure.
NOTE
The enclosure link ports are designed only to support c-Class
enclosures in the same rack. The enclosure link-down port on the
top enclosure is the service port. The enclosure link-down port
on the bottom linked enclosure is unused.
IMPORTANT
The HP BladeSystem c-Class enclosure link ports are not
compatible with the HP BladeSystem p-Class enclosure link
ports.
Recommendations
HP recommends the following for configuring BladeSystem c-Class enclosures:
• Use Virtual Connect or managed switches to reduce cabling and management overhead.
• Use the HP BladeSystem Power Sizer.
• For all server blades other than BL685c, the InfiniBand 4x DDR single-port mezzanine card will
work in Mezzanine 1, but it will work better in Mezzanine 2 or Mezzanine 3. For BL685c, the
InfiniBand 4x DDR single-port mezzanine card will work equally well in Mezzanine 1, Mezzanine
2, or Mezzanine 3 connectors.
• The
HP BladeSystem c-Class Solution Overview might indicate to install the Onboard Administrator
into the rear of the enclosure. This information applies to only the HP BladeSystem c7000
Enclosure. Install the Onboard Administrator module into the front of the HP BladeSystem c3000
Enclosure.
Summary
The HP BladeSystem c3000 Enclosure is the next generation of a new modular computing architecture
that consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more
effectively. The c3000 Enclosure is designed for remote sites, small and medium-sized businesses, and
data centers with special power and cooling constraints. Thermal Logic technologies provide the
mechanical design features, built-in intelligence, and control capabilities throughout the BladeSystem
c-Class that enable IT administrators to make the most of the power and thermal environments. The
shared, high-speed midplane and pooled-power backplane in the enclosure accommodate new
bandwidths and new technologies. The Onboard Administrator supplies an intelligent infrastructure to
provide essential power and cooling information and help automate the management of the
infrastructure.
The BladeSystem c3000 Enclosure provides all the power, cooling, and infrastructure to
support c-Class modular servers, interconnects, and storage components, today and throughout the
next several years.
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