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2000 Oct 17 7
Philips Semiconductors Product specification
UHF amplifier module BGY2016
PACKAGE OUTLINE
UNIT Qb
p
Zc
e
U
2
U
1
UFpq
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
99-02-06
IEC JEDEC EIAJ
mm
4.0
3.8
0.56
0.46
A
9.5
9.0
0.3
0.2
D
30.1
29.9
E
18.6
18.4
12.8
12.6
4.1
3.9
40.74
40.54
2.54
e
1
17.78
3.25
3.15
L
6.5
6.1
7.75
7.55
15.4
15.2
48.0
48.4
0.3 0.25
vw
0.1
y
DIMENSIONS (mm are the original dimensions)
SOT365A
0 10 20 mm
scale
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A
p
U
2
F
A
U
1
U
D
q
E
L
y
Q
c
v
A
A
w M
b
p
Z
234
1
e
1
ee