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2003 Sep 19 10
Philips Semiconductors Product specification
MMIC wideband medium power amplifier BGA6589
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
DIMENSIONS (mm are the original dimensions)
SOT89 TO-243 SC-62
97-02-28
99-09-13
w M
e
1
e
E
H
E
B
0 2 4 mm
scale
b
3
b
2
b
1
c
D
L
A
Plastic surface mounted package; collector pad for good heat transfer; 3 leads SOT89
123
UNIT
A
mm
1.6
1.4
0.48
0.35
c
0.44
0.37
D
4.6
4.4
E
2.6
2.4
H
E
4.25
3.75
e
3.0
w
0.13
e
1
1.5
L
min.
0.8
b
2
b
1
0.53
0.40
b
3
1.8
1.4