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BSS84 Rev B(W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= –250 µA
–50 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= –250 µA,Referenced to 25°C
–48
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= –50 V, V
GS
= 0 V –15
µA
V
DS
= –50 V,V
GS
= 0 V T
J
= 125°C
–60
µA
I
GSS
Gate–Body Leakage.
V
GS
= ±20 V, V
DS
= 0 V
±10
nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= –1 mA –0.8 –1.7 –2 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= –1 mA,Referenced to 25°C
3
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= –5 V, I
D
= –0.10 A
V
GS
= –5 V,I
D
= –0.10 A,T
J
=125°C
1.2
1.9
10
17
Ω
I
D(on)
On–State Drain Current V
GS
= –5 V, V
DS
= – 10 V –0.6 A
g
FS
Forward Transconductance V
DS
= –25V, I
D
= – 0.10 A 0.05 0.6 S
Dynamic Characteristics
C
iss
Input Capacitance 73 pF
C
oss
Output Capacitance 10 pF
C
rss
Reverse Transfer Capacitance
V
DS
= –25 V, V
GS
= 0 V,
f = 1.0 MHz
5 pF
R
G
Gate Resistance V
GS
= –15 mV, f = 1.0 MHz 9
Ω
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 2.5 5 ns
t
r
Turn–On Rise Time 6.3 13 ns
t
d(off)
Turn–Off Delay Time 10 20 ns
t
f
Turn–Off Fall Time
V
DD
= –30 V, I
D
= – 0.27A,
V
GS
= –10 V, R
GEN
= 6 Ω
4.8 9.6 ns
Q
g
Total Gate Charge 0.9 1.3 nC
Q
gs
Gate–Source Charge 0.2 nC
Q
gd
Gate–Drain Charge
V
DS
= –25 V, I
D
= –0.10 A,
V
GS
= –5 V
0.3 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current –0.13 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= –0.26 A(Note 2) –0.8 –1.2 V
t
rr
Diode Reverse Recovery Time 10 nS
Q
rr
Diode Reverse Recovery Charge
I
F
= –0.10A
d
iF
/d
t
= 100 A/µs (Note 2)
3 nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 350°C/W when mounted on a
minimum pad..
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
BSS84