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are not implemented). See See “I/O PORTS” on page 39. and Section 12.8 I/O PORT PIN CHARACTER-
ISTICS for more details.
3. OSC1 and OSC2 pins connect a crystal/ceramic resonator, or an external source to the on-chip oscil-
lator; see Section 1 INTRODUCTION and Section 12.5 CLOCK AND TIMING CHARACTERISTICS for
more details.
4. On the chip, each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up con-
figuration after reset. The configuration of these pads must be kept at reset state to avoid added current
consumption.
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